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Sources and References: INP Device Production

1. Semiconductor Process Control Literature

  • SEMI E44: Guide for Procurement of Fab Environmental Systems (focus on air stability, humidity, cleanliness).

  • SEMI E89: Specification for Airborne Molecular Contamination in Cleanrooms.

2. Photonic Integration Research Papers

Peer-reviewed publications demonstrating thermal sensitivity in InP-based PICs:

  • V. Van et al., Thermal Sensitivity of InP-Based Ring Resonators, IEEE Photonics Tech Letters, 2007.

  • L. Carroll et al., Temperature Dependence of InP Photonic Devices, Journal of Lightwave Technology, 2015.

These studies show resonant wavelength shifts of 8–10 pm/°C, implying ~0.1–1 pm shifts from ±0.01 °C control.

3. Metrology and Lithography System Specs

Public data sheets from manufacturers such as:

  • ASML (DUV/EUV lithography tools with ±0.1 °C to ±0.01 °C thermal stability for <30 nm overlay).

  • Raith/Elionix (e-beam writers that detail mechanical drift vs. temperature).

  • Bruker AFM and Keysight metrology tools that specify ambient and stage temperature sensitivities in nm/°C or pm/°C.

4. Thermal Expansion Coefficient DatA FOR INP

The equation ~4.6 × 10⁻⁶ /°C guides estimates of mechanical/optical drift from temperature changes.

Example: a 100 mm InP wafer expands ~460 nm per °C; ±0.01 °C yieldig ~4.6 nm change, justifying overlay and bonding drift estimates.

5. Industrial Case Studies and Whitepapers

Cleanroom engineering firms (e.g., Tropel, TSI, Camfil Farr) provide whitepapers with real-world data showing:

  • Improvements in stage drift, overlay, and yield from upgrading to tighter thermal zoning.

  • Intel and IBM fabs have historically used sub-±0.05 °C air control to support advanced litho and bonding.

6. Summary of Data Nature

Metric Basis of Estimate
Overlay alignment drift Tool vendor specs + thermal expansion.
Photonic loss (dB) Experimental trends in PIC alignment.
Resonator drift (pm/hr) Literature on dn/dT and Δλ/ΔT.
Stage drift (nm/hr) Metrology OEM datasheets.

7. Caveat

Exact quantitative values can vary by:

  • Tool architecture.

  • InP layer stack and thermal budget.

  • Fab environment and integration strategy.